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Advances in material depth profiling from Horiba






GDOES is used for fast elemental depth profile analysis of thin and thick films with thickness ranging from one nanometer to over 100 microns. This new option allows for upgrading existing Horiba GDOES systems as well as new instrument allows to measure depth as a function of time, layer thickness, erosion rates and GD crater depth, with nanometric precision. With the DiP (Differential interferometry profiling) option this is performed simultaneously with the GD analysis.

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