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New Dielectric cure analyser


The new Linseis Dielectric cure monitoring system measures electrical properties to determine the cure state and viscosity of thermoset materials, at the same time providing insight into chemistry, reaction rate, formulation and physical parameters.  Dielectric cure monitoring is a common method that can be used in Research and Development, Quality Assurance/Quality Control, and manufacturing, making quantitative information readily applicable and readily transferable to every aspect of polymer processing.

  • Epoxy
  • Polyurethane / Polyester / Polystyrene
  • Composites and laminates
  • Bulk/Sheet molding compound
  • Paints and coatings
  • Formulation, reaction rate and cure studies
  • Diffusion studies
  • Cure and process development/monitoring
  • Materials testing
  • Statistical quality control